A portion of a circuit board containing a temperature and relative humidity sensor needs to be exposed to the elements while at the same time protecting sensitive electronics on the same board. Design requirements include the need to provide geometry to fit into a standard box enclosure opening and provide a strain relief for the wires soldered to the circuit board.
Using Low Pressure overmolding, the result meets the expectations. Wire to board strain relief, directional transition, permanent protection to a portion of the circuit board, and physical characteristics in the overmold to accomodate the mounting feature in the final housing. Low pressure overmolding technology prevents delicate surface mount components from being damaged and has better long term resistance to thermal cycling than epoxied assemblies.
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